China's First Automotive-Grade Multi-Domain Fusion Chip "Hongqi 1" Debuts

Recently, China's first domestically developed automotive-grade, advanced-process multi-domain fusion chip, the "Hongqi 1," has been successfully developed. The chip is a joint effort by China FAW and several local tech companies. It achieves hardware-level integration of five major functional domains — including intelligent driving, cockpit infotainment, and body control — marking a critical step forward for China in the field of high-end automotive central compute chips. In traditional automotive electronic architectures, systems such as the cockpit, driving, and body are often controlled by separate chips, leading to frequent cross-domain data transfers that place heavy demands on vehicle storage bandwidth and real-time responsiveness. The "Hongqi 1" adopts a single-chip multi-domain fusion design, unifying originally scattered computing power and data streams. This significantly reduces cross-domain communication latency while providing a more predictable access pattern for the onboard storage subsystem. According to reports, the chip's logic computing capability is 21.7% higher than that of mainstream domain-fusion chips in the industry (such as the SA8775), while its image processing capability is 15.4% higher. These improvements enable efficient support for high-load scenarios such as "one chip, multiple screens, and multiple parallel operating systems" — for example, simultaneously driving the instrument cluster, center console, co-driver display, and rear-seat entertainment screens while smoothly running several independent OS environments.